InterOpto 2000 Report

- Optical interconnection technology development by the RWC Project -

The Real World Computing Partnership (RWCP) participated in InterOpto 2000 (with the main theme "Optoelectronics Links the World2), an international exhibition of the optical industry held in July 2000, and presented a panel on the RWC Project's optical interconnection technology development and displayed its products. The following is a brief report on InterOpto 2000 and the RWCP's exhibition.

1. InterOpto 2000 (International Optoelectronics Exhibition 2000)

Duration:	July 11 (Tue.) - July 14 (Fri.), 2000
Venue:	International Exhibition Halls #9 and #10, Makuhari Messe, Chiba, Japan
Participants:	254 companies (581 booths)
Visitors:	80,285
Sponsor and cosponsor:	Optoelectronic Industry and Technology Development Association (OITDA), Nihon Kogyo Shimbun

2.Panel presentation of optical interconnection technology developed by the RWC Project

• th No. 232 (18 m2)
• Panel presentation of the RWC Project and its optical interconnection technology development

  -Outline of the RWC Project

  -Research and development of optical interconnection technology and its results Panel presentation of the research subjects and specific contents of 8 RWC partnership members and exhibition of some of the prototypes

  
  Overall view of InterOpto 2000

• Research subjects:
  (1)Large-throughput optical network switch for the distributed parallel computing system (RHiNET) (Optical Interconnection Hitachi Lab.)
  (2)High Density Optical Bus (Optical Interconnection Oki Lab.)
  (3) IP Core and Long Wavelength VCSELs for Optical Interconnection (Optical Interconnection NEC Lab.)
  (4) Fiber-grating laser diode for WDM systems (Optical Interconnection Sumiden Lab.)
  (5) Space division multiplexing optical interconnection (SDMOI) (Optical Interconnection NSG Lab.)
  (6) Alignment Free VCSEL Module (Optical Interconnection Furukawa Lab.)
  (7) New multimode fiber ribbon for parallel optical interconnection (Optical Interconnection Fujikura Lab.)
  (8) 1.3 um Semiconductor Lasers on InGaAs Ternary Substrate -Towards Low-Driving-Voltage VCSELs for Optical Interconnection- (Optical Interconnection Fujitsu Lab.)

Brief review: The RWCP booth was located within the area for national and public institutes. The booth (18 m2) was twice as large as last year's oe and presentation panels and some prototypes were on display. Each laboratory stationed two attendants in turn to provide explanations, Q&A and other services to visitors.
As the booth area was larger, the interior was entirely renewed and computers and other equipment were set up to provide access to the RWCP's official site, partner laboratories' sites, and Web pages indicating RWCP research achievements. Some achievements of the project were also introduced by video.

Please refer the RWCP HP: http://www.rwcp.or.jp/events/interopto2000/